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IN-HOUSE DEVELOPED & COMMERCIALISED EQUIPMENT


Automated Integrated Test System (AITS) For Combined Microscopic And Macroscopic Analysis Of Hot-carrier Stressed Devices.

Cathodoluminescence (CL) System.

Characterization Of Interconnect Electromigration Defects Using Scanning Thermal Microscopy (SThM).
Field-Emission Induced Nanowires Growth and Characterisation Systems.

High Resolution Field-Emission Gun (FEG) Portable Mini SEM.

Scanning Electron Acoustic Microscopy (SEAM) for Subsurface Microelectronic Inspection & Failure Analysis.
 
 
Automated Integrated Test System (AITS) For Combined Microscopic And Macroscopic Analysis Of Hot-carrier Stressed Devices
 


Main Features:
  • An integrated system to cater for in-situ device characterization and photon emission measurements.
  • Full range of characterization techniques including Flicker Noise Measurement, Drain Current Conductance Method (DCCM), Charge-Pumping Measurement and Charge Profiling,Gated-Diode / GIDL Measurement, Capacitance-Voltage Measurement, Photon Emission Spectroscopy.
  • Fully automated experimental process.
Current Focus:
  • System is adapted to investigate oxide reliability using electroluminescence (EL) from dielectric film under high field bias.
  • Time resolved EL measurement to look at device reliability issues.
     
AITS System Setup
 




 
AITS Software
 


 


 



 
 
   
 

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Last modified on 5 June, 2005