1.
Imaging of Subsurface Cracks in
Cu/low-k Devices
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The SEAM image (Fig. 1(a)) clues-in
on the presence of a subsurface
feature as shown by the high
contrast zone in the upper right of
the field of view. A
cross-sectional trench was
subsequently milled using a Focused
Ion Beam (FIB), and the resultant
trench was imaged using an SEM (Fig.
1(b)), revealing the presence of a
subsurface crack propagating deep
(beyond 5 um) into the sample bulk.
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Fig. 1(a) SEAM Image.
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Fig. 1(b) SEM cross-section image of FIB
cut.
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2. Ferroelectric domains in BaTiO3
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This example demonstrates the
capability of SEAM in profiling
ferroelectric domains. The
Secondary Electron (SE) image (Fig.
2(a)) shows the homogeneous surface
topography of the BaTiO3
sample, while the SEAM image (Fig.
2(b)) reveals the ferroelectric
domain configuration within the bulk
of the sample.
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Fig. 2(a) SE Image of Sample
Surface.
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Fig. 2(b) SEAM Image showing ferroelectric
domains.
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